5G promises to bring a wholly linked mobile world to the masses, including everything from connected cars and smart cities to smartphones and internet of things (IoT) gadgets. According to the researchers, accelerating 5G adoption will necessitate a significant commitment from device and chipset makers. Not unexpectedly, chipmakers have been preparing for 5G with so many new chipsets and platforms.
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This includes:
● UNISOC’s T770,
● MediatekDimensity 1200
● Qualcomm’s Snapdragon X55 5G
● Samsung Exynos 1080
Radio Frequency integrated circuits (RFICs), system-on-chips (SoCs), application-specific integrated circuits (ASICs), cellular ICs, and millimetre-wave (mmWave) ICs are all examples of chipsets. Many of these companies are developing modems, RF front ends, or both, with many of them targeting sub-6 GHz spectrum and 100-MHz envelope-tracking (ET) bandwidths. The best 5G chipsets on the market are listed below.
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The T770 is part of UNISOC’s Tanggula 7 series, which is focused on bringing the user the experience of a better upgrade. It is expected that the UNISOC T770 will lead the way with its 2.5GHz octa-core processor with Mali-G57 GPU, up to 108 MP camera, and QHD+ 60Hz screen support.
UNISOC T770 is the world’s first 6nm EUV 5G chip. The T770 comes with many advanced specifications and supports a 108 million pixel high-definition camera with the latest Vivimagic 6.0 image engine, backed by Acutelogic. It also incorporates a new generation of AI dedicated acceleration engine, a full-pipeline 4K HDR display engine and supports a dual-screen expansion display.
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It also has a 120 frames high refresh rate, with Full HD, making multimedia and game experience seamless and smoother than imagined. It’s built as an innovative AI development platform to efficiently and rapidly enable more applications. Additionally, it supports 2G to 5G multi-mode and is compatible with SA and NSA modes. Importantly, it offers higher security.
It has a large capacity to support up to hundreds of applications simultaneously, and when compared with other mainstream SE solutions, the processing capacity is improved by 100%. It also uses innovative architecture with multi-mode fusion and AI intelligent regulation for ultra-low power consumption, which is 35% lower than its predecessor in 5G data-transitioning mode and 15% lower in 5G standby mode.
MediaTek’s new flagship 5G SoC Dimensity 1200 is based on 6-nanometer process. The CPU uses ARM’s latest A78 core with a frequency of 3.0GHz. There are also 3 large A78 cores with a frequency of 2.6GHz and 4 small A55 cores. Officially, the Dimensity 1200 performance has increased by 22%, and energy efficiency has increased by 25%.
The Dimensity 1200 integrates a new generation of modem. Officially, this chip is the first SoC that supports 5G high-speed rail mode and elevator mode. At the same time, the Dimensity 1200 adopts power-saving UltraSave technology to ensure power consumption under the SA network. In addition, the chip has 5G global band bandwidth support. And MediaTek claims that its downlink speed in urban areas is 25% faster than competing products.
It provides dynamic bandwidth-switching technology that allocates 5G bandwidth required for specific applications to improve modem power efficiency by 50% and extend battery life.The new AI processing unit supports more advanced AI applications, such as de-blur for imaging when subjects are moving fast. The Mali-G77 GPU enables extreme streaming and gaming at 5G speeds.
Qualcomm, Snapdragon X55 5G
The Snapdragon X55 is a 7-nm single-chip–integrated 5G to 2G multi-mode modem that supports 5G NR mmWave and sub-6-GHz spectrum bands with up to 7-Gbits/s download speeds and 3-Gbits/s upload speeds over 5G and Category 22 LTE with up to 2.5-Gbits/s LTE download speeds. The modem supports all major frequency bands, whether mmWave or sub-6 GHz and TDD and FDD modes of operations and arecapable of SA and NSA network deployments. It also supports dynamic spectrum sharing between 4G and 5G.
Snapdragon X55 is the first announced modem to support 100-MHz ET technology and adaptive antenna tuning for 5G sub-6 GHz, designed for power-efficient connectivity for next-generation smartphones and mobile devices.
Samsung Exynos 2100
The Exynos 2100 is Samsung’s first mobile chipset with integrated. It is based on a 5nm EUV process (Samsung). Compared with the previous generation products using the 7nm process, the Exynos 2100 reduces power consumption by 20% and improves overall performance by 10%.
Moreover, the Exynos 2100 chip uses a three-cluster structure, including a 2.9GHz ARM Cortex-X1 super core, three Cortex-A78 cores, and four Cortex-A55 cores. Samsung said that compared with previous products, the Exynos 2100 multi-core performance has increased by more than 30%.
In addition, the Exynos2100 uses ARM Mali-G78 GPU. The latter improves graphics performance by up to 40%. This chip also supports UFS 3.1 and UFS 2.1 storage. Plus, it can work with up to 200MP camera resolution.
The chipset industry is moving forward at an accelerated pace, and companies are trying everything to gain the upper hand in the domain. According to different forecasts, the global 5G chipset market – valued at USD 1-1.3 billion in 2019 – is expected to reach USD 22.41 Billion by 2026 and USD 40.45 billion by 2027. These numbers indicate the enormous growth potential, even though we are just in the third year of commercial 5G!
In the coming years, it is expected to register a double-digit CAGR between 2019 and 2027, becoming a multi-billion market. The latest announcements and product developments from 5G chip makers indicate that in 5G, the industry is poised to see even faster adoption of 5G capabilities as we move into 2022. In the future, there seems to be nothing that will be untouched by 5G. Everything from gadgets for smart homes, connected cars, and industrial sensors that share data every second will be bound together.
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